SSI MALAYSIA SDN BHD
No. 38, Jalan Serendah 26/39,
Kawasan Perindustrian Hicom,
Seksyen 26, 40400 Shah Alam,
Selangor, Malaysia.
+6017-765 3969

Advanced Hybrid Bonder

Advanced Hybrid Bonder Die Boner, Advanced Hybrid Bonder


Die bonding is the process of attaching the die either to its package or some substrate. A good die bonding process needs to be precisely aligned before place on the right pad. It also needs perfect contact between the die and the substrate without void. To achieve the perfect contact, the bonding head design must be able to aligned freely for the coplanarity. Because the die is weak and brittle, a fine tuning bonding force capability is mandatory to avoid destroying the die during bonding process.

For solder bonding, the fluxing process is important. Proper amount of the flux has to be precisely dispensed on the substrate. For epoxy bonding, precision epoxy dispensing can avoid excess of die attach fillet, which could result in the die attach contamination of the die surface or the problem of die lifting or die cracking due to less amount of epoxy material used. On the other hand, a good eutectic bonding needs proper control of the bonding temperature, duration and bonding force.

Model HB series is an advanced semiconductor die bonding machine designed to handle mixed assembly process besides bonding including pick-place for different components, micro dispensing or laser welding. Model HB600 is using the most intelligent motion control and vision integrated software V2K, which enables the highest assembly efficiency with friendly intuitive teaching method. SSI hybrid binder control technology includes the following important features:
  • State of the art vision alignment technology for sub-micro bonding combing the special camera system design, vision algorithms, image process software and AI technology for sub-micron alignment to 0.2 micron bonding applications.
  • Sophisticated bonding head design to handle critical bonding applications. SSI bonding head is able to control the bonding force with the integration of load cell and voice coil motor for fine force tuning to create gentle force for weak or small dies. In addition, SSI bond head special coplanarity alignment capability can ensure complete surface bonding.
  • Advanced micro dispensing technology for fast and precision jetting of flux, epoxy and conductive paste. Typical bonding machines are still using time pressure technology for dispensing, which is not accurate and slow. When dies are becoming smaller and smaller, SSI has the best advanced dispensing capabilities for any critical micro dispensing in term of precision and speed.
  • Intelligent pick-place is able to pick and align the parts angle before position alignment and placement or flip before placement. Different and multiple pickup heads design with software control for pick-up head auto change capability, Model HB series can run very high speed.

Accuracy XY Placement ±5um @3 Sigma
Wafer Size 4,6,8,12 inch
Wafer Die Size 150um~30mm
Die Thickness 50um~1000um
Force Control 1~100N

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