WLP (Wafer Level Package)

Due to the portable and multi-functional requirements of consumer electronic products, the development of microelectronic packaging is forced to move towards small size, high performance, and cost reduction. WLP (Wafer Level package) has the advantage of reducing package size and low cost, which makes it widely used in microelectronic packaging.
 
In the WLP packaging process, because the chips are densely arranged and the gaps are quite small, extremely precise glue volume control applications are very important. The Stream Jet piezoelectric jet dispensing device and software can solve the problem of wafer-level underfill process.

 

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